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Abstract
Collapse of fiberboard packaging boxes, in the shipping industry, due to rise in humidity conditions is common and very costly. A 3D FE nonlinear model is developed to predict the moisture flow throughout a corrugated packaging fiberboard sandwich structure. The model predicts how the moisture diffusion will permeate through the layers of a fiberboard (medium and facings). The model predicts the deformation response, the loss of stiffness, and the creep response. The FE results are compared with an experimental set-up used at the Forest Product Laboratory in Madison, WI for a panel subjected to a sweptsine humidity function to study its response to varying humidity function. The panel modeled in this analysis consists of two facings made from liner material separated by a corrugated medium. The liner and medium will be assigned orthotropic stress strain relations; bilinear stress-strain curves generated from experimental data under variable moisture contents namely 50% and 90% RH. The liner and medium will be modeled as 8-noded shell elements, which allow for curved medium geometry. The major orthogonal directions are the machine direction (MD), the cross machine direction (CD), and the out-of- lane z direction. The layers are assumed perfectly bonded at juncture lines. The moisture flow is considered in one direction across the thickness of the fiberboard. The fiberboard will be subjected to transient moisture analysis coupled with an edge wise compressive loading. The transient analysis is dependent on the following material constants: oefficient of moisture diffusivity, and coefficient of moisture expansion. The FE model will provide results showing moisture diffusion flow, creep deformation response in the fiberboard under the action of a static compressive loading and a periodic moisture actual experimental data.
Citation
Rahman, Adeeb A.; Urbanik, Thomas J.; Mahamid, Mustafa. 2003. Response of corrugated fiberboard to moisture flow : a 3-D finite element transient nonlinear analysis. Proceedings of 2003 International Paper Physics Conference, 2003 September 7-11, Victoria, B.C., Canada. Montreal, Canada : PAPTAC, 2003: Pages 277-281.