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Abstract
CCA-treated southern yellow pine (SYP) chips were remediated utilizing acid extraction alone, and using acid extraction followed by bioleaching with the metal-tolerant bacterium Bacillus licheniformis CC01. bCleanedc chips were used to make particleboard (PB) with 10 percent urea-formaldehyde (UF) resin, and the PB samples were evaluated for internal bond (IB), modulus of elasticity (MOE), modulus of rupture (MOR), thickness swell (TS), water absorption, and decay resistance. PB panels prepared from just acid-extracted chips and two-step remediated chips showed an average 22 and 28 percent reduction, respectively, in IB and 41 and 13 percent reduction, respectively, in MOR compared to values for PB prepared with untreated SYP chips. An 8 to 10 percent increase in MOE in the acid-extracted-chip PB and remediated-chip PB compared to the untreated-chip PB suggested densification of the fiber surface had occurred. Water absorption and TS after 24-hour submersion increased in PB prepared from acid-extracted and remediated chips (14% to 15%). Water absorption and TS were less (28% and 39%, respectively) for the acid-extracted-chip PB compared to the untreated-chip PB. Decay resistance was variable, with low weight losses (
Keywords
Pinus contorta,
Bacillus licheniformis,
Gloeophyllum trabeum,
Wood destroying fungi,
Decay fungi,
Particleboards,
Panels,
Copper chrome arsenates,
Wood properties,
Modulus of elasticity,
Thickness,
Water intake,
Postia placenta
Citation
Clausen, Carol A.; Kartal, S. Nami.; Muehl, James. 2001. Particleboard made from remediated CCA-treated wood : evaluation of panel properties. Forest products journal. Vol. 51, nos. 7/8 (July/Aug. 2001).:p. 61-64.