Factors that lead to failure with wood adhesive bonds

Charles R. Frihart; James Beecher

Treesearch

Factors that lead to failure with wood adhesive bonds

Informally Refereed

Authors:

Charles R. Frihart, James Beecher

Year:

2016

Type:

Paper

Station:

Forest Products Laboratory

Source:

World Conference on Timber Engineering, WCTE 2016, August 22-25, 2016, Vienna, Austria.

Download (PDF 568 KB)

Download (PDF 568 KB): https://research.fs.usda.gov/download/treesearch/53607.pdf

Abstract

Understanding what makes a good wood adhesive is difficult since the type of adhesive, wood species, bonding process, and resultant products vary considerably. Wood bonds are subjected to a variety of tests that reflect the different product performance criteria in diverse countries. The most common tests involve some type of moisture resistance; both wood and adhesive factors influence this moisture related failure. Models have been developed to explain the adhesive performance. The proper microscopic and spectroscopic techniques can lead to a better understanding of the failure mechanism so that improved adhesives can be designed and bonding processes can be optimized.

Keywords

wood, adhesive, failure, microscopy, spectroscopy, moisture, epoxy

Citation

Frihart, Charles R.; Beecher, James F. 2016. Factors that lead to failure with wood adhesive bonds. In: World Conference on Timber Engineering, WCTE 2016, 22-25 August 2016. Vienna, Austria. 8 pp.